Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15980206Application Date: 2018-05-15
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Publication No.: US10658720B2Publication Date: 2020-05-19
- Inventor: Yuta Ashida , Noriyuki Hirabayashi , Shigemitsu Tomaki
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2511974
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H03H7/38 ; H03H7/01 ; H03H1/00

Abstract:
A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.
Public/Granted literature
- US20190007018A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2019-01-03
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