Invention Grant
- Patent Title: Laser machining apparatus projecting guide pattern onto workpiece by irradiating visible laser beam thereon
-
Application No.: US16224502Application Date: 2018-12-18
-
Publication No.: US10661385B2Publication Date: 2020-05-26
- Inventor: Yasuo Nishikawa , Yoshihisa Kusumoto
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Aichi-Ken
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Aichi-Ken
- Agency: K&L Gates LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2224515
- Main IPC: B23K26/082
- IPC: B23K26/082 ; B23K26/359 ; B23K26/02 ; G05B19/4067 ; B23Q15/00 ; B23K26/042 ; B23K26/03 ; B23K26/044 ; B23K26/352 ; B23K26/361 ; B23K26/0622

Abstract:
A laser machining apparatus includes: a laser beam emission device; a visible laser beam emission device; a scanner; and a controller. The controller is configured to perform: generating machining data including coordinate data representing a machining pattern to be machined on a workpiece; machining the workpiece with a laser beam according to the machining data by controlling the laser beam emission device and the scanner; generating, in response to receiving a resuming command after the machining has been halted at a stopping position, a guide pattern based on a stopping point coordinate and the machining data, the guide pattern being used for resuming the machining from the stopping position, the stopping point coordinate indicating the stopping position and being determined by the coordinate data; and projecting the guide pattern onto the workpiece with a visible laser beam by controlling the visible laser beam emission device and the scanner.
Public/Granted literature
Information query
IPC分类: