发明授权
- 专利标题： Electronic sub-assembly and method for the production of an electronic sub-assembly
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申请号： US15564626申请日： 2016-03-07
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公开(公告)号： US10665389B2公开(公告)日： 2020-05-26
- 发明人: Martin Haug , Dragan Dinulovic
- 申请人： Würth Elektronik eiSos GmbH & Co. KG
- 申请人地址： DE Waldenburg
- 专利权人： Würth Elektronik eiSos GmbH & Co. KG
- 当前专利权人： Würth Elektronik eiSos GmbH & Co. KG
- 当前专利权人地址： DE Waldenburg
- 代理机构： Boyle Fredrickson S.C.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2cea3d2
- 国际申请： PCT/EP2016/054777 WO 20160307
- 国际公布： WO2016/162153 WO 20161013
- 主分类号： H01F41/04
- IPC分类号： H01F41/04 ; H01F27/255 ; H01F17/00 ; H01F27/29 ; H01F17/04 ; H01F27/28 ; H01F27/40 ; H01F41/02 ; H01F41/06
摘要：
An electronic component that includes at least one main body composed of ferrite material, at least one coil embedded in the main body, and at least one conductor track which runs on a side of the main body from a bottom side to a top side of the main body configured such that the main body has at least two side surfaces which enclose an angle of less than 180 angular degrees, where the conductor track is arranged in a recess at the transition between the two side surfaces.
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