发明授权
- 专利标题: Infrared pixel structure, manufacturing method thereof and hybrid image device
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申请号: US16310818申请日: 2016-11-07
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公开(公告)号: US10670468B2公开(公告)日: 2020-06-02
- 发明人: Xiaoxu Kang , Shoumian Chen
- 申请人: SHANGHAI IC R&D CENTER CO., LTD.
- 申请人地址: CN Shanghai
- 专利权人: SHANGHAI R&D CENTER CO., LTD
- 当前专利权人: SHANGHAI R&D CENTER CO., LTD
- 当前专利权人地址: CN Shanghai
- 代理机构: Tianchen LLC.
- 代理商 Yuan R. Li; Yi Fan Yin
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@53f9d9a1
- 国际申请: PCT/CN2016/098382 WO 20161107
- 国际公布: WO2018/014439 WO 20180125
- 主分类号: G01J5/34
- IPC分类号: G01J5/34 ; H01L37/02 ; H04N5/33 ; G01J5/00
摘要:
The present invention provides an infrared pixel structure and a hybrid imaging device which use comb-shaped top plates and bottom plates to form capacitors. The upper electrode has a non-fixed end such that the infrared sensitive element in the upper electrode generates thermal stress and deforms when absorbing the infrared light, which changes the capacitance of the capacitors formed by the top plates and the bottom plates to achieve infrared detection and increase the device sensitivity. Furthermore, the infrared pixel structure can be used in an infrared light and visible light hybrid imaging device to achieve visible light imaging and infrared imaging in a same silicon substrate, so as to increase the imaging quality.
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