A chip on film according to the present disclosure includes a base film, a plurality of signal wirings on an upper surface and a lower surface of the base film to transmit a signal in two signal paths, a driving unit on one surface of the upper surface and the lower surface of the base film, a first pad and a second pad on one surface of the upper surface and the lower surface of the base film, and a plurality of through holes between the first pad and the second pad and electrically connect to the signal wiring.