Invention Grant
- Patent Title: Fan-out semiconductor package
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Application No.: US15923708Application Date: 2018-03-16
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Publication No.: US10672719B2Publication Date: 2020-06-02
- Inventor: Kang Heon Hur , Jong Man Kim , Kyung Ho Lee , Han Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4e4265f5
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L21/48 ; H01L21/683 ; H01L21/56 ; H01L23/36
Abstract:
A semiconductor package includes a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns, a semiconductor chip disposed on the wiring portion, an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip, and a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 μm to 70 μm.
Public/Granted literature
- US20190096824A1 FAN-OUT SEMICONDUCTOR PACKAGE Public/Granted day:2019-03-28
Information query
IPC分类:
