- 专利标题： Package structures and methods of forming the same
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申请号： US16403641申请日： 2019-05-06
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公开(公告)号： US10672734B2公开(公告)日： 2020-06-02
- 发明人: Li-Hsien Huang , An-Jhih Su , Hsien-Wei Chen
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065 ; H01L23/31 ; H01L21/56 ; H01L21/683 ; H01L23/498
摘要：
Package structures and methods of forming the same are disclosed. One of the package structures includes a first die, a second die, a dummy substrate and an encapsulant. A bottom surface of the second die is adhered to a top surface of the dummy substrate through a glue layer, and a total area of the bottom surface of the second die is different from a total area of the top surface of the dummy substrate. A total thickness of the first die is substantially equal to a total thickness of the second die, the dummy substrate and the glue layer. The encapsulant is disposed aside the first die, the second die and the dummy substrate.
公开/授权文献
- US20190259727A1 PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME 公开/授权日：2019-08-22
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