Invention Grant
- Patent Title: Lead frame style communications connectors
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Application No.: US15803926Application Date: 2017-11-06
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Publication No.: US10673195B2Publication Date: 2020-06-02
- Inventor: Robert E. Fransen , Louann M. Devine , Frank M. Straka
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Christopher S. Clancy; James H. Williams; Christopher K. Marlow
- Main IPC: H01R13/6467
- IPC: H01R13/6467 ; H01R43/26 ; H01R43/20 ; H01R24/64 ; H01R13/6461

Abstract:
Various implementations of lead frame style communications connectors are disclosed. In some implementations, a lead frame style communications connector may include a plurality of conductors each including a plug contact region and an opposing cable conductor termination region. Each of the plurality of conductors may be arranged in one of a first subset of conductors and a second subset of conductors. The lead frame style communications connector a mandrel separating the first subset of conductors from the second subset of conductors.
Public/Granted literature
- US20180109060A1 LEAD FRAME STYLE COMMUNICATIONS CONNECTORS Public/Granted day:2018-04-19
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