Invention Grant
- Patent Title: Modulation method and apparatus
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Application No.: US16130293Application Date: 2018-09-13
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Publication No.: US10673563B2Publication Date: 2020-06-02
- Inventor: Xi Yan , Huixiao Ma , Wai Kong Raymond Leung , Long Luo , Yan Cui
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@53014146
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H03M13/25 ; H03M7/40

Abstract:
Embodiments of this application provide a modulation method and apparatus. The method includes: receiving a code word sequence, where each code word includes N bits, and the code word sequence includes at least a first code word; mapping the code word sequence into M sequences, where each sequence includes N/M bits from the first code word; mapping the M sequences into a symbol sequence, where each symbol is corresponding to M bits, the M bits are respectively from the M sequences, first bits corresponding to N/M first-type symbols are from the first code word, and second bits corresponding to N/M second-type symbols are from the first code word. Thus a signal-to-noise ratio requirement during higher order modulation lowered.
Public/Granted literature
- US20190013824A1 MODULATION METHOD AND APPARATUS Public/Granted day:2019-01-10
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