Invention Grant
- Patent Title: Housing including metal material and electronic device including same
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Application No.: US16522896Application Date: 2019-07-26
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Publication No.: US10674623B2Publication Date: 2020-06-02
- Inventor: Hyunjung Jeong , Youngsoo Jang , Yunsung Ha , Yongwook Hwang , Changyoun Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@50b30199
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H01M2/10 ; H05K7/02 ; G06F1/16 ; G06F1/18

Abstract:
A device, a house for the device and a method are disclosed herein. The device includes a first plate, a second plate facing an opposite direction, a side member integrally formed with the second plate, surrounding a space between the first the second plate, and a mid-plate coupled to the side member, extending into the space, the side member further including an aluminum substrate layer formed between a first and second surface exposed within the space, an aluminum oxide layer formed between the first surface and the aluminum substrate layer including multiple pores, a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, and a second layer formed on the first layer as to form the first surface, the second layer comprising titanium.
Public/Granted literature
- US20200037460A1 HOUSING INCLUDING METAL MATERIAL AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2020-01-30
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