Invention Grant
- Patent Title: Packing system and method
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Application No.: US15742100Application Date: 2016-07-06
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Publication No.: US10676222B2Publication Date: 2020-06-09
- Inventor: Hyun Cheol Kim , Shin Kim
- Applicant: OCI Company Ltd.
- Applicant Address: KR Seoul
- Assignee: OCI Company Ltd.
- Current Assignee: OCI Company Ltd.
- Current Assignee Address: KR Seoul
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@548fa385
- International Application: PCT/KR2016/007321 WO 20160706
- International Announcement: WO2017/007237 WO 20170112
- Main IPC: B65B9/067
- IPC: B65B9/067 ; B65H23/04 ; B65H23/00 ; B65B59/00 ; B65B49/04 ; B65B9/22 ; B65B41/16 ; B65B57/04 ; B65B9/06

Abstract:
The present invention relates to a packing system including a transporting device, an erecting device, and a guiding device. The packing system is configured to reduce the number of packing operations and to simplify the packing process, thereby improving production efficiency, compared with a conventional system. The packing system is configured to minimize wrinkling of a packing material and to adjust position of ends of the packing material in a way that the packing material is always supplied to a predetermined position, thereby reducing a failure rate of a packed product. It is possible to pack various sizes of packing target objects using a single system.
Public/Granted literature
- US20180201398A1 PACKING SYSTEM Public/Granted day:2018-07-19
Information query
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