A solder printing inspection device that inspects a printing state of solder paste printed on a substrate having a through hole into which a lead terminal of an insertion component is inserted, the solder printing inspection device including: a non-printing face side illuminator that irradiates an inspection range on a non-printing face side with a predetermined light, wherein the non-printing face side is opposite to a printing face side, out of a surface and a rear face of the substrate; a non-printing face side camera that takes an image of the inspection range on the non-printing face side of the substrate irradiated with the predetermined light; and a controller that executes inspection with regard to the solder paste in the inspection range, based on image data with regard to the inspection range on the non-printing face side of the substrate taken by the non-printing face side camera.