Invention Grant
- Patent Title: Electronic device with integrated temperature sensor and manufacturing method thereof
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Application No.: US15960509Application Date: 2018-04-23
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Publication No.: US10682645B2Publication Date: 2020-06-16
- Inventor: Praveen Kumar Radhakrishnan , Dino Faralli
- Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS ASIA PACIFIC PTE LTD
- Applicant Address: IT Agrate Brianza SG Singapore
- Assignee: STMICROELECTRONICS S.R.L.,STMICROELECTRONICS ASIA PACIFIC PTE LTD
- Current Assignee: STMICROELECTRONICS S.R.L.,STMICROELECTRONICS ASIA PACIFIC PTE LTD
- Current Assignee Address: IT Agrate Brianza SG Singapore
- Agency: Seed Intellectual Property Law Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6b827e8d
- Main IPC: B01L3/00
- IPC: B01L3/00 ; G01K7/02 ; G01F1/684 ; G01F1/688 ; H01L35/32

Abstract:
A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
Public/Granted literature
- US20180236447A1 ELECTRONIC DEVICE WITH INTEGRATED TEMPERATURE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-08-23
Information query
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