Invention Grant
- Patent Title: Fingerprint sensing structure with small curvature radius
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Application No.: US16116876Application Date: 2018-08-29
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Publication No.: US10685207B2Publication Date: 2020-06-16
- Inventor: Hsiang-Yu Lee , Shang Chin , Ping-Tsun Lin , Chia-Hsun Tu
- Applicant: SUPERC-TOUCH CORPORATION
- Applicant Address: TW New Taipei
- Assignee: SUPERC-TOUCH CORPORATION
- Current Assignee: SUPERC-TOUCH CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2725d53a
- Main IPC: G06K9/20
- IPC: G06K9/20 ; G06K9/00 ; H01L51/00 ; H01L27/12 ; H01L23/498

Abstract:
A fingerprint sensing structure includes a flexible substrate divided into a fingerprint-sensing region and a non-fingerprint-sensing region. In the non-fingerprint-sensing region, the fingerprint sensing structure includes a plurality of organic insulating layers, a wiring layer having conductive wires and at least one inorganic insulating layer, where the wiring layer is sandwiched between two organic insulating layers to render the portion of the fingerprint sensing structure corresponding to non-fingerprint-sensing region to have bending with curvature radius not larger than 2 mm. In the finger sensing region, the fingerprint sensing structure includes a thin film transistor layer and a sensing electrode layer. The thin film transistor layer includes a plurality of thin film transistors, a plurality of conductive wires respectively along a first direction and a second direction. The sensing electrode layer has a plurality of sensing electrodes to sense surface features of living organism.
Public/Granted literature
- US20190095683A1 FINGERPRINT SENSING STRUCTURE WITH SMALL CURVATURE RADIUS Public/Granted day:2019-03-28
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