发明授权
- 专利标题： Semiconductor package having routable encapsulated conductive substrate and method
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申请号： US16032295申请日： 2018-07-11
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公开(公告)号： US10685897B2公开(公告)日： 2020-06-16
- 发明人: Won Bae Bang , Byong Jin Kim , Gi Jeong Kim , Jae Doo Kwon , Hyung Il Jeon
- 申请人： Amkor Technology Inc.
- 申请人地址： SG Singapore
- 专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Kevin B. Jackson
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a1ecdec
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L23/495 ; H01L21/683 ; H01L23/498 ; H01L23/532 ; H01L21/48 ; H01L23/48
摘要：
A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.
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