Invention Grant
- Patent Title: Board-to-board interconnect apparatus including a microstrip circuit connected by a waveguide, where a bandwidth of a frequency band is adjustable
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Application No.: US15555396Application Date: 2015-06-02
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Publication No.: US10686241B2Publication Date: 2020-06-16
- Inventor: Hyeon Min Bae , Ha Il Song , Huxian Jin
- Applicant: Korea Advanced Institute of Science and Technology
- Applicant Address: KR Daejeon
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Daejeon
- Agency: Dinsmore & Shohl LLP
- Agent Yongsok Choi, Esq.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@42bba290
- International Application: PCT/KR2015/005505 WO 20150602
- International Announcement: WO2016/140401 WO 20160909
- Main IPC: H01P5/107
- IPC: H01P5/107 ; H01P1/203 ; H01P3/08 ; H01P3/16 ; H01P5/08 ; H01P5/10

Abstract:
Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
Public/Granted literature
- US20180040937A1 CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE Public/Granted day:2018-02-08
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