Invention Grant
- Patent Title: Intelligent SIM profile procurement
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Application No.: US16417436Application Date: 2019-05-20
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Publication No.: US10687204B1Publication Date: 2020-06-16
- Inventor: Tanmay Roy , Cristian Asandului , Kyeong Hun An , Phani Ramisetty , Mathew George , Ryan King
- Applicant: T-Mobile USA, Inc.
- Applicant Address: US WA Bellevue
- Assignee: T-Mobile USA, Inc.
- Current Assignee: T-Mobile USA, Inc.
- Current Assignee Address: US WA Bellevue
- Agency: Han Santos, PLLC
- Main IPC: H04W8/18
- IPC: H04W8/18 ; H04L29/06 ; G06K19/06 ; G06F21/73 ; H04L29/08 ; H04B1/3816

Abstract:
A mobile network operator (MNO) may receive a request to provide an embedded Subscriber Identity Module (eSIM) profile to an embedded Universal Integrated Circuit Card (eUICC) of a user device. The user device is configured to receive telecommunication services from the MNO. Thus, if it is determined that a particular remote SIM provisioning (RSP) platform of a plurality of RSP platforms is able to provide the eSIM profile, the particular RSP platform is directed to provision the eUICC of the user device with the eSIM profile. However, if a condition that affects an ability of the particular RSP platform to provide the eSIM profile is detected, an alternative RSP platform may be directed to provide the eUICC of the user device with the eSIM profile.
Information query