- 专利标题： Power supply device having multiple power modules physically connected with each other and electronic device comprising the same
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申请号： US15883253申请日： 2018-01-30
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公开(公告)号： US10687416B2公开(公告)日： 2020-06-16
- 发明人: Shin Ho Kang , Sung Yong Joo , Yong Joo Lee
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7895d80
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K7/14 ; G01R31/40 ; H05K5/00 ; G01R31/50
摘要：
A power supply device includes a first power module including a first printed circuit board in which a first protrusion part is formed along a first side surface of the first printed circuit board facing a first direction, a second power module including a second printed circuit board in which a first groove is formed along a second side surface of the printed circuit board facing the first side surface of the first printed circuit board in a second direction, and a third power module including a third printed circuit board electrically connecting the first printed circuit board and the second printed circuit board. The first protrusion part is inserted into the first groove to physically connect the first printed circuit board to the second printed circuit board.