- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US15921265Application Date: 2018-03-14
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Publication No.: US10689248B2Publication Date: 2020-06-23
- Inventor: Ming Yen Lee , Chia Hao Sung , Ching-Han Huang , Yu-Hsuan Tsai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81B3/00 ; B81C1/00 ; H01L23/538 ; H01L23/48 ; H01L23/522 ; H01L23/52 ; H01L23/525 ; H01L21/66 ; B81C3/00 ; H01L23/31 ; H01L23/13 ; H01L23/12 ; H01L23/28
Abstract:
The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.
Public/Granted literature
- US20180265347A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-09-20
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