Invention Grant
- Patent Title: Configurations and positioning of contact bar segments on a capping board for enhanced current density homogeneity and/or short circuit reduction
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Application No.: US14895051Application Date: 2014-06-04
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Publication No.: US10689771B2Publication Date: 2020-06-23
- Inventor: Robert P. Dufresne
- Applicant: PULTRUSION TECHNIQUE INC.
- Applicant Address: CA Saint-Bruno, Quebec
- Assignee: Pultrusion Technique, Inc.
- Current Assignee: Pultrusion Technique, Inc.
- Current Assignee Address: CA Saint-Bruno, Quebec
- Agency: BakerHostetler
- International Application: PCT/CA2014/050514 WO 20140604
- International Announcement: WO2014/194421 WO 20141211
- Main IPC: C25C7/00
- IPC: C25C7/00 ; C25C1/00

Abstract:
Techniques for installing contact bar segments in an electrolytic cell can include positioning a series of contact bar segments on a capping board to provide enhanced current density distribution in the series of contact bar segments positioned along the capping board, the contact bar segments including at least three contact regions for anodes and cathodes. In some scenarios, sub-sets of contact bar segments may be provided, such that one sub-set is configured to contact N number of anodes and N number of cathodes; another sub-set is configured to contact N number of anodes and N+1 number of cathodes including one center segment; and a further sub-set configured to contact N+1 number of anodes and N number of cathodes including two end segments.
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Information query