Invention Grant
- Patent Title: Method for manufacturing image sensor
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Application No.: US16201083Application Date: 2018-11-27
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Publication No.: US10700117B2Publication Date: 2020-06-30
- Inventor: Yuichiro Yamashita , Chun-Hao Chuang , Hirofumi Sumi
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
Methods for forming an image sensor structure are provided. The method includes forming a light-sensing region in a substrate and forming a storage node adjacent to light-sensing region in the substrate. The method further includes forming a front side isolation structure partially surrounding an upper portion of the light-sensing region and forming a trench fully surrounding a bottom portion of the light-sensing region to expose a bottom surface of the front side isolations structure. The method further includes forming a backside isolation structure in the trench.
Public/Granted literature
- US20190109164A1 METHOD FOR MANUFACTURING IMAGE SENSOR Public/Granted day:2019-04-11
Information query
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