Invention Grant
- Patent Title: Integrated system chip with magnetic module
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Application No.: US16416529Application Date: 2019-05-20
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Publication No.: US10700125B2Publication Date: 2020-06-30
- Inventor: Katherine H. Chiang , Chung-Te Lin , Min Cao , Han-Ting Tsai , Pin-Cheng Hsu , Yen-Chung Ho
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/10 ; H01L43/02

Abstract:
The present disclosure relates to magnetic memory device. The magnetic memory device includes a bottom electrode, a selector layer disposed over the bottom electrode, and a MTJ stack disposed over the selector layer and comprising a reference layer and a free layer disposed over the reference layer and separated from the reference layer by a tunneling barrier layer. The magnetic memory device further includes a modulating layer disposed over the MTJ stack and a top electrode disposed over the switching threshold modulating layer. The selector layer is configured to switch current on and off based on applied bias.
Public/Granted literature
- US20200105830A1 INTEGRATED SYSTEM CHIP WITH MAGNETIC MODULE Public/Granted day:2020-04-02
Information query
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