Invention Grant
- Patent Title: Connection device, manufacturing method of the same, and electronic device including the same
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Application No.: US16410642Application Date: 2019-05-13
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Publication No.: US10700470B2Publication Date: 2020-06-30
- Inventor: Young-Sik Choi , Jong-Min Choi , Woong-Chan Kim , Dae-Hyeong Park , Sung-Gun Cho , Min-Sung Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2e10f120
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R13/66 ; H01R24/58 ; H04M1/02 ; H01R12/71 ; H01R43/20 ; H01R43/24 ; H01R13/443 ; H04M1/18

Abstract:
A connection device and method of manufacturing the same is provided. The connection device includes a housing including a first face, into which a plug is introduced, and a second face, that is formed to be in contact with the first face; a connection hole extending to the inside of the housing from the first face; an opening extending from the first face to the second face to partially expose the connection hole on at least the second face; and a sealing member arranged on an outer peripheral surface of the housing to surround a region where the opening is formed.
Public/Granted literature
- US20190267751A1 CONNECTION DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2019-08-29
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