Invention Grant
- Patent Title: Module attachment device
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Application No.: US15828970Application Date: 2017-12-01
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Publication No.: US10704576B2Publication Date: 2020-07-07
- Inventor: Hiroyuki Murakami , Keiichi Taketani
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Main IPC: F16M13/00
- IPC: F16M13/00 ; F16B2/04 ; B64D11/00 ; B64D11/06

Abstract:
A module attachment device includes: a first module that includes a first casing and a first moving member, the first moving member being configured such that when a first end is pushed, a second end protrudes from the first casing; and a second module that is engaged with a mounting surface, and includes a second moving member that is disposed at a position where the second moving member is capable of pushing the first end of the first moving member, wherein in response to the first end of the first moving member being pushed by the second moving member, the second end of the first moving member protruding from the first casing comes into engagement with the mounting surface.
Public/Granted literature
- US20180231034A1 MODULE ATTACHMENT DEVICE Public/Granted day:2018-08-16
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