Invention Grant
- Patent Title: Photonic integrated circuit packages
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Application No.: US16211712Application Date: 2018-12-06
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Publication No.: US10705302B2Publication Date: 2020-07-07
- Inventor: Ho Chul Ji , Keun Yeong Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee IP Law, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7fa9a066
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/43 ; G02B6/124 ; G02B6/12 ; G02B6/30 ; G02B6/34
Abstract:
A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.
Public/Granted literature
- US20190265421A1 PHOTONIC INTEGRATED CIRCUIT PACKAGES Public/Granted day:2019-08-29
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