Invention Grant
- Patent Title: Chip electronic component
-
Application No.: US14961414Application Date: 2015-12-07
-
Publication No.: US10707012B2Publication Date: 2020-07-07
- Inventor: Jong Suk Jeong , Kang Heon Hur , Seong Jae Lee , Jung Wook Seo , Hiroyuki Matsumoto , Chul Min Sim , Jong Sik Yoon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonngi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonngi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74f0d7e3
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/36 ; H01F17/00
Abstract:
A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.
Public/Granted literature
- US20160172098A1 CHIP ELECTRONIC COMPONENT Public/Granted day:2016-06-16
Information query
