Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US15757197Application Date: 2016-11-04
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Publication No.: US10707187B2Publication Date: 2020-07-07
- Inventor: Jung Hak Kim , Hee Jung Kim , Se Ra Kim , Jung Ho Jo , Kwang Joo Lee , Seung Hee Nam , Young Kook Kim
- Applicant: LG Chem, Ltd.
- Applicant Address: KR
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5005b8a2
- International Application: PCT/KR2016/012676 WO 20161104
- International Announcement: WO2017/078469 WO 20170511
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L23/28 ; H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L25/00
Abstract:
The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.
Public/Granted literature
- US20180261576A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-09-13
Information query
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