发明授权
- 专利标题: SRAM structure
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申请号: US15953818申请日: 2018-04-16
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公开(公告)号: US10714484B2公开(公告)日: 2020-07-14
- 发明人: Feng-Ming Chang , Chia-Hao Pao , Lien-Jung Hung , Ping-Wei Wang
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 主分类号: H01L27/11
- IPC分类号: H01L27/11 ; H01L27/02 ; H01L29/06 ; G11C11/417 ; G11C11/412
摘要:
An SRAM structure is provided. The SRAM structure includes a plurality of first well regions with a first doping type, a plurality of second well regions with a second doping type, a third well region with the second doping type, a plurality of first well pick-up regions, a plurality of second well pick-up regions, and a plurality of memory cells. The first well regions, the second well regions, and the third well region are formed in a semiconductor substrate. The third well region is adjacent to the second well regions. The first well pick-up regions are formed in the first well regions. The second well pick-up regions are formed in the third well region. The second well pick-up regions are shared by the third well region and the second well regions. The memory cells are formed on the first and second well regions.
公开/授权文献
- US20190164978A1 SRAM STRUCTURE 公开/授权日:2019-05-30
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