- 专利标题: Semiconductor device
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申请号: US15753342申请日: 2016-09-05
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公开(公告)号: US10714606B2公开(公告)日: 2020-07-14
- 发明人: Youngshin Eum , Kazuhiro Oyama , Yasushi Higuchi , Yoshinori Tsuchiya , Shinichi Hoshi
- 申请人: DENSO CORPORATION
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ab20f1 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6590c643
- 国际申请: PCT/JP2016/075924 WO 20160905
- 国际公布: WO2017/051688 WO 20170330
- 主分类号: H01L29/778
- IPC分类号: H01L29/778 ; H01L29/06 ; H01L29/812 ; H01L29/205 ; H01L29/872 ; H01L29/40 ; H01L29/20 ; H01L29/10 ; H01L29/423
摘要:
A semiconductor device includes a conductive substrate, a channel forming layer, a first electrode, and a second electrode. The channel forming layer is located above the conductive substrate and includes at least one hetero-junction structure. The hetero-junction structure includes a first GaN-type semiconductor layer providing a drift region and a second GaN-type semiconductor layer having a bandgap energy greater than the first GaN-type semiconductor layer. A total fixed charge quantity of charges in the first GaN-type layer and the second GaN-type layer is from 0.5×1013 to 1.5×1013 cm−2. The charges in the first GaN-type layer and the second GaN-type layer include charges generated by the polarization in the first GaN-type layer. Accordingly, the semiconductor device capable of improving a break-down voltage and decreasing an on-resistance is obtained.
公开/授权文献
- US20180248026A1 SEMICONDUCTOR DEVICE 公开/授权日:2018-08-30
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