Invention Grant
- Patent Title: Wearable devices with increased adhesion
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Application No.: US16664059Application Date: 2019-10-25
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Publication No.: US10715904B2Publication Date: 2020-07-14
- Inventor: Shawn J. Prevoir , Kai Gao
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: Bose Corporation
- Current Assignee: Bose Corporation
- Current Assignee Address: US MA Framingham
- Agency: Fish & Richardson P.C.
- Main IPC: H04R1/10
- IPC: H04R1/10 ; A61B5/00 ; A61B5/024
Abstract:
Headphone ear tips are made with an outer surface that changes its coefficient of friction. The outer surface is coated with photochromic compound, hierarchical microstructures, fibers formed through electrostatic flocking, or a combination thereof.
Public/Granted literature
- US20200059716A1 WEARABLE DEVICES WITH INCREASED ADHESION Public/Granted day:2020-02-20
Information query
