Invention Grant
- Patent Title: Direct connection of high speed signals on PCB chip
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Application No.: US16048267Application Date: 2018-07-28
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Publication No.: US10716213B2Publication Date: 2020-07-14
- Inventor: Hyunjun Kim , Andy Becker , Jim Fitzke , Brad Smith , Paul Wildes
- Applicant: Cray Inc.
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H01B11/18 ; H01R12/71

Abstract:
To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
Public/Granted literature
- US20200037448A1 DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP Public/Granted day:2020-01-30
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