Invention Grant
- Patent Title: Fingerprint identification circuit, method for manufacturing fingerprint identification circuit, and display device
-
Application No.: US16043923Application Date: 2018-07-24
-
Publication No.: US10719684B2Publication Date: 2020-07-21
- Inventor: Zhonglin Cao , Weiyun Huang , Shan Gao , Yang Wang , Tingliang Liu , Yuanjie Xu , Ting Li , Pengcheng Zang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chengdu, Sichuan
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu, Sichuan
- Agency: Brooks Kushman P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2a84450b
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G03F7/00 ; G06F3/042 ; G06F3/041 ; H01L27/12

Abstract:
A fingerprint identification circuit, a method for manufacturing the fingerprint identification circuit, and a display device are provided. The fingerprint identification circuit includes: an array substrate and an opposite substrate arranged opposite to the array substrate; a fingerprint identification member arranged at a side of the array substrate proximate to the opposite substrate; and a backlight source arranged at a side of the array substrate distal to the opposite substrate. A light-shielding member and a partially-transparent member are arranged on the opposite substrate. An orthogonal projection of the partially-transparent member onto the array substrate at least partially overlaps an orthogonal projection of the fingerprint identification member onto the array substrate.
Public/Granted literature
Information query