Invention Grant
- Patent Title: Build material source container
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Application No.: US15735937Application Date: 2016-05-12
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Publication No.: US10723076B2Publication Date: 2020-07-28
- Inventor: Ismael Chanclon Fernandez , Ernesto Alejandro Jones Poppescou , Xavier Alonso Becerro
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HGF Limited
- International Application: PCT/EP2016/060661 WO 20160512
- International Announcement: WO2017/194112 WO 20171116
- Main IPC: B29C64/255
- IPC: B29C64/255 ; B22F3/105 ; B33Y40/00 ; B33Y99/00 ; B29C64/20 ; B33Y30/00 ; B29C64/153

Abstract:
There is provided a build material source container for use in a material management station of a three dimensional, 3D, printer. The source container defines a substantially enclosed space for holding build material and has an aperture for build material ingress and egress. At least part of the build material source container is formed from an electrically conductive material. The conductive material portion of the build material source container is connectable to Earth to discharge static electricity generated within the build material source container.
Public/Granted literature
- US20190061250A1 A BUILD MATERIAL SOURCE CONTAINER Public/Granted day:2019-02-28
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