- 专利标题: Semiconductor package for reducing stress to redistribution via
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申请号: US15965590申请日: 2018-04-27
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公开(公告)号: US10734342B2公开(公告)日: 2020-08-04
- 发明人: Seok Hwan Kim , Han Kim , Kyung Ho Lee , Kyung Moon Jung
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Sughrue Mion, PLLC
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@69d6fc3c
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/28 ; H01L23/498 ; H01L23/538 ; H01L23/16 ; H01L23/31
摘要:
A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.
公开/授权文献
- US20190189579A1 SEMICONDUCTOR PACKAGE 公开/授权日:2019-06-20