Invention Grant
- Patent Title: Method for manufacturing exterior housing and electronic device comprising same
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Application No.: US15751212Application Date: 2016-05-26
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Publication No.: US10750629B2Publication Date: 2020-08-18
- Inventor: Young-Gyun Kim , Minjung Kim , Jeeyoung Oh , Gyoosug Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@75be99a1
- International Application: PCT/KR2016/005547 WO 20160526
- International Announcement: WO2017/026633 WO 20170216
- Main IPC: H05K5/02
- IPC: H05K5/02 ; B32B27/08 ; B32B27/30 ; B32B27/36 ; H04M1/02 ; H05K5/00 ; B32B1/00 ; B29C43/00 ; B29C43/02 ; B29C43/50 ; B29C43/52 ; B29K33/00 ; B29K69/00 ; B29K105/00 ; B29L31/34

Abstract:
An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.
Public/Granted literature
- US20180249586A1 METHOD FOR MANUFACTURING EXTERIOR HOUSING AND ELECTRONIC DEVICE COMPRISING SAME Public/Granted day:2018-08-30
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