Invention Grant
- Patent Title: Integrated liquid-cooled heat dissipation system
-
Application No.: US16183690Application Date: 2018-11-07
-
Publication No.: US10750638B2Publication Date: 2020-08-18
- Inventor: Qineng Xiao
- Applicant: GUANGDONG APALTEK LIQUID COOLING TECHNOLOGY CO., LTD.
- Applicant Address: CN Qingxi Town, Dongguan
- Assignee: GUANGDONG APALTEK LIQUID COOLING TECHNOLOGY CO., LTD.
- Current Assignee: GUANGDONG APALTEK LIQUID COOLING TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Qingxi Town, Dongguan
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5a34cf25
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20 ; F28F1/12 ; H01L23/34 ; F28D1/053 ; F28D1/02 ; F28D21/00

Abstract:
An integrated liquid-cooled heat dissipation system includes a heat dissipation device, a pumping device, a water reservoir, and a heat absorption device. The heat dissipation device, the pumping device, the water reservoir, and the heat absorption device are integrated as a whole and interconnected with each other, a main body of the heat dissipation device is provided with the pumping device; the water reservoir is integratedly arranged on and connected to the heat dissipation device; and the heat absorption device is arranged on the water reservoir.
Public/Granted literature
- US20190075681A1 INTEGRATED LIQUID-COOLED HEAT DISSIPATION SYSTEM Public/Granted day:2019-03-07
Information query