Invention Grant
- Patent Title: Three-dimensional structure
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Application No.: US15857498Application Date: 2017-12-28
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Publication No.: US10751970B2Publication Date: 2020-08-25
- Inventor: Jih-Hsiang Yeh , Yu-Tsung Chiu , Shih-Ming Chen , Chih-Kang Peng
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: B32B3/12
- IPC: B32B3/12 ; B32B3/08 ; B32B3/28 ; B33Y80/00

Abstract:
A three-dimensional structure includes a plate and a three-dimensional component disposed on the plate. The three-dimensional component contains at least one first structure and at least one second structure. The first structure is an auxetic structure, and the second structure is different from the first structure. The at least one first structure and the at least one second structure are provided layer by layer along a thickness direction of the plate on the plate.
Public/Granted literature
- US20190202163A1 THREE-DIMENSIONAL STRUCTURE Public/Granted day:2019-07-04
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