Invention Grant
- Patent Title: Low dielectric constant (DK) and dissipation factor (DF) material for nano-molding technology (NMT)
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Application No.: US16627409Application Date: 2018-12-28
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Publication No.: US10752771B2Publication Date: 2020-08-25
- Inventor: Hui Peng , Bing Guan , Wei Shan
- Applicant: SABIC GLOBAL TECHNOLOGIES B.V.
- Applicant Address: NL Bergen op Zoom
- Assignee: SABIC Global Technologies B.V.
- Current Assignee: SABIC Global Technologies B.V.
- Current Assignee Address: NL Bergen op Zoom
- Agency: BakerHostetler
- International Application: PCT/IB2018/060704 WO 20181228
- International Announcement: WO2019/130269 WO 20190704
- Main IPC: C08L67/02
- IPC: C08L67/02 ; B29C45/00 ; H01Q1/36 ; C08J5/04 ; B29C45/14 ; B29K67/00 ; B29K309/08 ; B29L31/34
Abstract:
The disclosure concerns thermoplastic resin compositions including a polymer resin, a dielectric glass fiber component, a hollow glass fiber, and an impact modifier.
Public/Granted literature
- US20200140679A1 LOW DIELECTRIC CONSTANT (DK) AND DISSIPATION FACTOR (DF) MATERIAL FOR NANO-MOLDING TECHNOLOGY (NMT) Public/Granted day:2020-05-07
Information query
