Invention Grant
- Patent Title: Temperature and leakage compensation for memory cells in an analog neural memory system used in a deep learning neural network
-
Application No.: US16183250Application Date: 2018-11-07
-
Publication No.: US10755783B2Publication Date: 2020-08-25
- Inventor: Hieu Van Tran , Steven Lemke , Nhan Do , Vipin Tiwari , Mark Reiten
- Applicant: Silicon Storage Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: SILICON STORAGE TECHNOLOGY
- Current Assignee: SILICON STORAGE TECHNOLOGY
- Current Assignee Address: US CA San Jose
- Agency: DLA Piper LLP US
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G06F17/16 ; G06N3/063 ; G06N3/08 ; G06N3/04

Abstract:
Numerous embodiments are disclosed for providing temperature compensation and leakage compensation for an analog neuromorphic memory system used in a deep learning neural network. The embodiments for providing temperature compensation implement discreet or continuous adaptive slope compensation and renormalization for devices, reference memory cells, or selected memory cells in the memory system. The embodiments for providing leakage compensation within a memory cell in the memory system implement adaptive erase gate coupling or the application of a negative bias on a control gate terminal, a negative bias on a word line terminal, or a bias on a source line terminal.
Public/Granted literature
Information query