Invention Grant
- Patent Title: Bonding apparatus, bonding system, bonding method and storage medium
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Application No.: US16553530Application Date: 2019-08-28
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Publication No.: US10756046B2Publication Date: 2020-08-25
- Inventor: Yoshitaka Otsuka , Takashi Nakamitsu , Yosuke Omori , Kenji Sugakawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3b75f7c4
- Main IPC: B32B41/00
- IPC: B32B41/00 ; H01L23/00 ; H01L21/677 ; H01L21/67 ; H01L21/683 ; B32B15/01 ; H01L21/18 ; H01L21/20 ; H01L21/68 ; B32B37/10 ; B32B37/00
Abstract:
There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
Public/Granted literature
- US20190385973A1 Bonding Apparatus, Bonding System, Bonding Method and Storage Medium Public/Granted day:2019-12-19
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