Invention Grant
- Patent Title: Integrated circuit structure with complementary field effect transistor and buried metal interconnect and method
-
Application No.: US16152454Application Date: 2018-10-05
-
Publication No.: US10756096B2Publication Date: 2020-08-25
- Inventor: Bipul C. Paul , Ruilong Xie
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent Anthony J. Canale
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L27/092 ; H01L27/11 ; H01L23/528 ; H01L21/768 ; H01L29/423 ; H01L29/78 ; H01L29/06

Abstract:
Disclosed are structures with a complementary field effect transistor (CFET) and a buried metal interconnect that electrically connects a source/drain region of a lower-level transistor of the CFET with another device. The structure can include a memory cell with first and second CFETs, where each CFET includes a pull-up transistor stacked on and having a common gate with a pull-down transistor and each pull-down transistor has a common source/drain region with a pass-gate transistor. The metal interconnect connects a lower-level source/drain region of the first CFET (i.e., the common source/drain region of first pass-gate and pull-up transistors) to the common gate of the second CFET (i.e., to the common gate of second pull-down and pull-up transistors). Formation methods include forming an interconnect placeholder during lower-level source/drain region formation. After upper-level source/drain regions and replacement metal gates are formed, the interconnect placeholder is exposed, removed and replaced with a metal interconnect.
Public/Granted literature
Information query
IPC分类: