- 专利标题： Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil
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申请号： US16235116申请日： 2018-12-28
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公开(公告)号： US10757849B2公开(公告)日： 2020-08-25
- 发明人: Masahiro Watanabe
- 申请人： Tatsuta Electric Wire & Cable Co., Ltd.
- 申请人地址： JP Osaka
- 专利权人： Tatsuta Electric Wire & Cable Co., Ltd.
- 当前专利权人： Tatsuta Electric Wire & Cable Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Potomac Law Group, PLLC
- 代理商 Kenneth Fagin
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2761ca56
- 主分类号： H05K3/06
- IPC分类号： H05K3/06 ; H05K3/38 ; H05K9/00 ; H05K1/09 ; H05K1/02 ; H05K1/03
摘要：
An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m2 per 24 hours or higher at a temperature of 80 degrees centigrade, a moisture of 95% RH, and a pressure difference of 1 atm.
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