Invention Grant
- Patent Title: Stress isolation platform for MEMS devices
-
Application No.: US16160965Application Date: 2018-10-15
-
Publication No.: US10759659B2Publication Date: 2020-09-01
- Inventor: Xin Zhang , Michael Judy , George M. Molnar , Christopher Needham , Kemiao Jia
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: B81B7/00
- IPC: B81B7/00
Abstract:
A MEMS product includes a stress-isolated MEMS platform surrounded by a stress-relief gap and suspended from a substrate. The stress-relief gap provides a barrier against the transmission of mechanical stress from the substrate to the platform.
Public/Granted literature
- US20190047846A1 STRESS ISOLATION PLATFORM FOR MEMS DEVICES Public/Granted day:2019-02-14
Information query
