- 专利标题： Semiconductor wafer measurement method and system
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申请号： US16400833申请日： 2019-05-01
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公开(公告)号： US10762621B2公开(公告)日： 2020-09-01
- 发明人: Peng-Ren Chen , Shiang-Bau Wang , Wen-Hao Cheng , Yung-Jung Chang , Wei-Chung Hu , Yi-An Huang , Jyun-Hong Chen
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Hauptman Ham, LLP
- 主分类号： G06T7/00
- IPC分类号： G06T7/00 ; G06K9/62
摘要：
A method includes capturing a raw image from a semiconductor wafer, assigning a measurement box in the raw image, arranging a pair of indicators in the measurement box according to graphic data system (GDS) information of the semiconductor wafer, measuring a distance between the indicators, and performing a manufacturing activity based on the measured distance.
公开/授权文献
- US20190259140A1 SEMICONDUCTOR WAFER MEASUREMENT METHOD AND SYSTEM 公开/授权日：2019-08-22
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