Invention Grant
- Patent Title: Substrate warpage detection device, substrate warpage detection method, and substrate processing apparatus and substrate processing method using the same
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Application No.: US16026395Application Date: 2018-07-03
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Publication No.: US10763147B2Publication Date: 2020-09-01
- Inventor: Junnosuke Taguchi , Yuya Sasaki , Toshiya Chiba
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath. Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3ab7c771
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01N21/95 ; H01L21/687 ; G01B11/30
Abstract:
A substrate warpage detection device for detecting warpage of a substrate loaded on a substrate loading region having a recess shape formed on a rotary table along a circumferential direction during rotation of the rotary table, includes a light transmitting part configured to transmit a light beam obliquely upward from a side of the rotary table such that a lower portion of the light beam collides with an upper end of a side surface of the rotary table and an upper portion of the light beam positioned more upward than the lower portion of the light beam passes a portion near the surface of the rotary table, and a light receiving part installed to face the light transmitting part and configured to receive the light beam passing the portion near the surface of the rotary table so as to detect an amount of received light.
Public/Granted literature
Information query
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