Invention Grant
- Patent Title: Image sensor chips having sub-chips
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Application No.: US16203912Application Date: 2018-11-29
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Publication No.: US10763294B2Publication Date: 2020-09-01
- Inventor: Jaekyu Lee , Sung In Kim , Byung-Joon Baek
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2b1bf592
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/369 ; H04N5/3745 ; H04N5/378

Abstract:
An image sensor chip may include a first sub-chip, a second sub-chip on the first sub-chip, and an interconnector between the first and second sub-chips. The first sub-chip may include a first substrate, a bottom electrode on a first region of the first substrate, and a first capacitor on the bottom electrode. The first capacitor may include a plurality of first electrodes vertically extending from a top surface of the bottom electrode, a second electrode on the first electrodes, and a first dielectric layer between the second electrode and the first electrodes. The second sub-chip may include a pixel array configured to convert incident light into an electrical signal. The pixel array may be electrically connected through the interconnector to the first capacitor.
Public/Granted literature
- US20190267423A1 Image Sensor Chips Having Sub-Chips Public/Granted day:2019-08-29
Information query
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