Invention Grant
- Patent Title: Elevator landing door leaf
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Application No.: US15788962Application Date: 2017-10-20
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Publication No.: US10773928B2Publication Date: 2020-09-15
- Inventor: Aki Haikonen , Mikko Kuronen
- Applicant: Kone Corporation
- Applicant Address: FI Helsinki
- Assignee: Kone Corporation
- Current Assignee: Kone Corporation
- Current Assignee Address: FI Helsinki
- Agency: Harness, Dickey and Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2e319fdf
- Main IPC: B66B13/30
- IPC: B66B13/30

Abstract:
The invention refers to an elevator door leaf comprising a door panel and a support structure having at least one profile. The door leaf comprises a vertically extending expansion member which is fixed to the door leaf only at one vertical level, whereby the expansion member consists of a material having a larger thermal expansion coefficient than the material of the door panel and/or of said profile.
Public/Granted literature
- US20180037441A1 ELEVATOR LANDING DOOR LEAF Public/Granted day:2018-02-08
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