Invention Grant
- Patent Title: Gate stacks
-
Application No.: US16201624Application Date: 2018-11-27
-
Publication No.: US10777651B2Publication Date: 2020-09-15
- Inventor: Yushi Hu , John Mark Meldrim , Eric Blomiley , Everett Allen McTeer , Matthew J. King
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegmon Lundberg & Woessner, P.A.
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/28 ; H01L29/66 ; H01L29/78 ; H01L29/06

Abstract:
Some embodiments disclose a gate stack having a gate (e.g., polysilicon (poly) material) horizontally between shallow trench isolations (STIs), a tungsten silicide (WSix) material over the gate and the STIs, and a tungsten silicon nitride (WSiN) material on a top surface of the WSix material. Some embodiments disclose a gate stack having a gate between STIs, a first WSix material over the gate and the STIs, a WSiN interlayer material on a top surface of the first WSix material, and a second WSix material on a top surface of the WSiN interlayer material. Additional embodiments are disclosed.
Public/Granted literature
- US20190097017A1 GATE STACKS Public/Granted day:2019-03-28
Information query
IPC分类: