Invention Grant
- Patent Title: Optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip
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Application No.: US16462349Application Date: 2017-12-12
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Publication No.: US10777708B2Publication Date: 2020-09-15
- Inventor: Fabian Kopp , Attila Molnar
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3454ee14
- International Application: PCT/EP2017/082439 WO 20171212
- International Announcement: WO2018/114483 WO 20180628
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/46 ; H01L33/00 ; H01L33/32 ; H01L33/40

Abstract:
An optoelectronic semiconductor chip includes a semiconductor layer sequence, a transparent substrate, at least one contact trench, at least one insulating trench, at least one current distribution trench, at least in the insulating trench, an electrically insulating mirror layer that reflects radiation generated in an active layer, at least one metallic current web in the contact trench configured for a current conduction along the contact trench and supplying current to a first semiconductor region, and at least one metallic busbar in the current distribution trench that energizes a second semiconductor region, wherein the contact trench, the isolating trench and the current distribution trench extend from a side of the second semiconductor region facing away from the substrate through the active layer into the first semiconductor region, and the contact trench is completely surrounded by the insulating trench, and the current distribution trench lies only outside the insulating trench.
Public/Granted literature
- US20190341526A1 OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP Public/Granted day:2019-11-07
Information query
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