- Patent Title: Chip-to-chip interface comprising a waveguide with a dielectric part and a conductive part, where the dielectric part transmits signals in a first frequency band and the conductive part transmits signals in a second frequency band
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Application No.: US16145576Application Date: 2018-09-28
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Publication No.: US10777865B2Publication Date: 2020-09-15
- Inventor: Hyeon Min Bae , Ha Il Song , Joon Yeong Lee , Tae Hoon Yoon , Hyo Sup Won
- Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Daejeon
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Daejeon
- Agency: Dinsmore & Shohl LLP
- Agent Yongsok Choi, Esq.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6d2c71b5 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@67a77826 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2f042dc6
- Main IPC: H01P1/213
- IPC: H01P1/213 ; H01P3/16 ; H01P3/10 ; H01P5/08 ; H01P3/12 ; H01P5/02 ; H01P3/08 ; H01Q9/04 ; H01Q13/06 ; H04L12/40
Abstract:
The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part.
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